JPH0219967Y2 - - Google Patents

Info

Publication number
JPH0219967Y2
JPH0219967Y2 JP1985173762U JP17376285U JPH0219967Y2 JP H0219967 Y2 JPH0219967 Y2 JP H0219967Y2 JP 1985173762 U JP1985173762 U JP 1985173762U JP 17376285 U JP17376285 U JP 17376285U JP H0219967 Y2 JPH0219967 Y2 JP H0219967Y2
Authority
JP
Japan
Prior art keywords
wire
ball
radius
diameter
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985173762U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6282735U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985173762U priority Critical patent/JPH0219967Y2/ja
Publication of JPS6282735U publication Critical patent/JPS6282735U/ja
Application granted granted Critical
Publication of JPH0219967Y2 publication Critical patent/JPH0219967Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1985173762U 1985-11-12 1985-11-12 Expired JPH0219967Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985173762U JPH0219967Y2 (en]) 1985-11-12 1985-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985173762U JPH0219967Y2 (en]) 1985-11-12 1985-11-12

Publications (2)

Publication Number Publication Date
JPS6282735U JPS6282735U (en]) 1987-05-27
JPH0219967Y2 true JPH0219967Y2 (en]) 1990-05-31

Family

ID=31111525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985173762U Expired JPH0219967Y2 (en]) 1985-11-12 1985-11-12

Country Status (1)

Country Link
JP (1) JPH0219967Y2 (en])

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5340057Y2 (en]) * 1976-07-16 1978-09-28
JPS54160168A (en) * 1978-06-09 1979-12-18 Citizen Watch Co Ltd Pressure bonding capillary chip

Also Published As

Publication number Publication date
JPS6282735U (en]) 1987-05-27

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